Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP. CISA required action: Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
Structured advisory · Revision 1Original source
Evidence and details
Imported from structured advisory data. Source references identify upstream records or fields; verify affected versions and your deployed configuration.
Security context
Source reference: kev:CVE-2023-33063
Multiple Chipsets
Source reference: /product
- Affected versions
- Not stated in this record
- Fixed versions
- Not stated in this record
- Prerequisites
- Not stated in this record
- Related CVEs
- CVE-2023-33063
Source reference:
/cveID
Publisher severity
No explicit severity was provided.